Factors affecting the performance of conductive adhesive

Title: In depth exploration of the key factors affecting the performance of conductive adhesive. As an adhesive with conductive properties, conductive adhesive is widely used in the electronics industry. It can connect two or more electronic components together while providing a certain level of mechanical strength and electrical performance. However, the performance of conductive adhesive is influenced by various factors, which directly affect its performance in specific applications. This article will discuss in detail the main factors that affect the performance of conductive adhesives, providing reference for engineers and technicians to choose and use conductive adhesives. The formula composition of conductive adhesive is the basis for determining its performance. The main components include: 1 Matrix material (usually epoxy resin): Provides the physical stability and heat resistance of the adhesive. 2. Curing agent: reacts with the matrix to form a cross-linked structure, enhancing the hardness and durability of the material. 3. Fillers: such as silver powder, copper powder, etc., determine the conductivity of the adhesive. 4. Solvent: Used to control solidification time and reduce viscosity for easy coating. 5. Other additives: Improve certain specific properties, such as antioxidants, rheological modifiers, etc. Different formula components and their proportions can significantly alter the characteristics of conductive adhesives, therefore, customized development is required according to specific application requirements when designing products. In the process of preparing conductive adhesive, some key process parameters can also have a significant impact on its performance: 1 Mixing uniformity: Ensuring full mixing of all components is crucial for achieving consistent performance. 2. Drying time: During the transition from liquid to solid, an appropriate drying time helps to improve the stability of the adhesive. 3. Curing temperature and time: The correct curing conditions can effectively improve the hardness, heat resistance, and conductivity of the adhesive. 4. Coating thickness: An appropriate coating thickness can not only ensure good conductivity, but also avoid stress concentration caused by excessive thickness. Environmental factors, usage environment, and storage conditions also have a significant impact on the performance of conductive adhesives: 1 Humidity: A humid environment may cause hydrolysis or oxidation of conductive adhesive, thereby reducing its conductivity. 2. Temperature: In high temperature environments, conductive adhesive may soften or even melt, while at low temperatures it may become too brittle and hard. 3. UV radiation: Long term exposure to UV radiation can cause the conductive adhesive to age and reduce its performance. 4. Chemical substances: Contact with certain chemicals may lead to the degradation of conductive adhesive, so the erosion of such substances should be avoided as much as possible in the use environment. Different application scenarios have different requirements for conductive adhesives: 1 Printed Circuit Board Assembly (PCBA): It is required that the conductive adhesive has excellent conductivity and heat resistance to ensure the normal operation of electronic devices at high frequency and high power. 2. Semiconductor packaging: In addition to basic conductive functions, conductive adhesives should also have good thermal management ability and reliability. 3. Electromagnetic shielding: In such applications, conductive adhesive needs to have high impedance matching and electromagnetic wave absorption ability. 4. Flexible electronic products: The conductive adhesive on the flexible substrate also needs to meet the characteristics of small bending radius and good performance after multiple bends. There are many factors that affect the performance of conductive adhesive, including formula composition, process parameters, environmental factors, and the final application scenario. In order to fully leverage the advantages of conductive adhesives, engineers and technicians should comprehensively consider the above factors in the design and selection process, and conduct sufficient testing and verification to determine the optimal solution. Only in this way can we ensure that the conductive adhesive performs the most ideal effect in practical applications.