SMT conductive foam is an electromagnetic compatibility (EMC) component that can be used for SMT process mounting. It is mainly used in PCB assembly process to provide effective and stable grounding points and effective EMI shielding effect. SMT conductive foam can be used for high-speed surface mounting using automated processes, and has suitable conductivity and excellent heat resistance, excellent durability and stability, as well as the ability to absorb external impacts. SMT conductive foam is mainly used in electronic devices such as antennas, mobile phones, computers, cameras, PCBs, etc. SMT conductive foam can provide metal shell grounding, shock and vibration resistance, EMI shielding, and electrical contact. Structure and characteristics of SMT conductive foam: 1 SMT conductive foam consists of: outer conductive PI (usually nickel plated, gold plated conductive PI); Composed of silicone rubber elastic core. 2. Excellent surface resistance (≤ 0.03 Ω/s2) and good conductivity. 3. It can be quickly and stably assembled on a PCB using reflow soldering technology. 4. Welding is tight and firm. 5. Customizable appearance and size, with a wide range. 6. Compression resilience can be customized according to needs, with low permanent compression deformation and good recovery. 7. Anti seismic and impact protection. 8. Efficient electromagnetic interference shielding. 9. Complies with RoHS standards. 10. High temperature resistance (260 ℃), flame retardant (UL94-V0) SMT conductive foam application: 1 Radio frequency and antenna 1.1 Antenna shrapnel 1.2 Metal shell grounding 1.3 Grounding of antenna small board 2. Grounding of antenna related metal parts 2.1 Product Application – Connection and EMI 2.2 Main board grounding 2.3 Plate to plate connection shrapnel 2.4 Contact shrapnel such as SPK BOX and flash
